Interested in achieving high quality surfaces of almost any material for Scanning Electron Microscopy (SEM) investigations and Microstructure Analysis?
It is our pleasure to invite you to this online workshop. We will talk about the mechanical, target pre-preparation followed by ion beam cross sectioning and ion beam broad milling for material science applications.
The session will consist of a presentation of Leica EM TXP and Leica EM TIC 3X followed by an online demonstration of the systems.
Topic: Mechanical, target pre-preparation followed by ion beam cross sectioning / ion beam broad milling for material science applications
Date: 10 September 2020
Time: Berlin 10:00 am
Speaker: Thomas Pfeifer & Andreas Nowak, Advanced Workflow Specialist & Product Manager, Leica Microsystems
We look forward to seeing you online!